Researchers at the King Abdullah University of Science and Technology in Saudia Arabia are continuing with their experiments to transform traditional rigid electronic wafers made from silicon into mechanically flexible and transparent ones. In their new work, they have succeeded in transforming silicon-on-insulator (SOI) FinFETS (the semiconductor industry’s most complex transistor) into flexible FinFETs using a new soft-etch based substrate thinning process able to etch the back face of the silicon substrate. The technique could allow for new applications in consumer electronics, such as in the emerging field of the “Internet of Things”…..
http://nanotechweb.org/cws/article/tech/58573
